Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257311 | Method of fabricating a semiconductor package with heat dissipating structure having a deformed supporting portion | Yueh-Ying Tsai, Yong Chen | 2016-02-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257311 | Method of fabricating a semiconductor package with heat dissipating structure having a deformed supporting portion | Yueh-Ying Tsai, Yong Chen | 2016-02-09 |