Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9460908 | Method and device for slicing a shaped silicon ingot using layer transfer | — | 2016-10-04 |
| 9362439 | Layer transfer of films utilizing controlled shear region | — | 2016-06-07 |
| 9356181 | Substrate cleaving under controlled stress conditions | Al Lamm, Yi-Lei Chow | 2016-05-31 |
| 9336989 | Method of cleaving a thin sapphire layer from a bulk material by implanting a plurality of particles and performing a controlled cleaving process | — | 2016-05-10 |
| 9257339 | Techniques for forming optoelectronic devices | Sien G. Kang, Albert Lamm | 2016-02-09 |