Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9373567 | Lead frame, manufacture method and package structure thereof | — | 2016-06-21 |
| 9324633 | Multi-level package assembly having conductive vias coupled to chip carrier for each level and method for manufacturing the same | — | 2016-04-26 |
| 9245872 | Flip-chip package structure and method for an integrated switching power supply | — | 2016-01-26 |