Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9433109 | Wiring substrate and semiconductor package | Kentaro Kaneko | 2016-08-30 |
| 9420696 | Method of manufacturing wiring substrate | Takayuki Kiwanami, Junji Sato | 2016-08-16 |
| 9313894 | Wiring substrate and manufacturing method of wiring substrate | Takayuki Kiwanami, Junji Sato | 2016-04-12 |
| 9313904 | Wiring board and method of manufacturing wiring board | Kentaro Kaneko | 2016-04-12 |
| 9253897 | Wiring substrate and method for manufacturing the same | Kentaro Kaneko, Kazuhiro Kobayashi | 2016-02-02 |
| 9232657 | Wiring substrate and manufacturing method of wiring substrate | Takayuki Kiwanami, Junji Sato | 2016-01-05 |