Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515050 | Electronic apparatus having a resin filled through electrode configured to go through first and second semiconductor components | Kenta Uchiyama | 2016-12-06 |
| 9386695 | Wiring substrate having multiple core substrates | Jun Furuichi, Naoyuki Koizumi | 2016-07-05 |
| 9299678 | Semiconductor package and manufacturing method therefor | Masahiro Kyozuka, Toru Hizume | 2016-03-29 |