Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9487846 | Electroconductive bonding material | Isamu Osawa | 2016-11-08 |
| 9227258 | Lead-free solder alloy having reduced shrinkage cavities | Yuji Kawamata, Min-Kyu Kang, Kayako Nakagawa, Yasuaki Kokubu | 2016-01-05 |