Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9401309 | Multiheight contact via structures for a multilevel interconnect structure | Keisuke Izumi, Naohito Yanagida, Michiaki Sano, Takehiro Yamazaki, Hiroaki Iuchi +2 more | 2016-07-26 |