Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257309 | Multi-chip package and method of manufacturing the same | Hee Jin Lee | 2016-02-09 |
| 9245827 | 3D semiconductor device | Uk-Song Kang, Dong-Hyeon Jang, Seong-Jin Jang, Hoon Lee, Jin Ho Kim +2 more | 2016-01-26 |