Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9420709 | Coreless board for semiconductor package, method of manufacturing the same, and method of manufacturing semiconductor package using the same | Young Kwan Lee, Myung Sam Kang, Joo Hwan Jung, Ju-hee Park | 2016-08-16 |