Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9299685 | Multi-chip package having a logic chip disposed in a package substrate opening and connecting to an interposer | — | 2016-03-29 |
KK
Kil-Soo Kim
Overall (2016): #326,344 of 481,213Top 70%
1
Patents 2016