Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9398694 | Method of manufacturing a package for embedding one or more electronic components | Thomas Merkle, Stefan Koch | 2016-07-19 |
| 9343779 | Method of preparing electrode assembly and electrode assembly prepared using the method | Hyun Kyung Do, Jong Mo Jung, You Rim Yoon, Young Geun Choi, Seung Jae Yoon +2 more | 2016-05-17 |