Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9472539 | Semiconductor chip and a semiconductor package having a package on package (POP) structure including the semiconductor chip | Yong Hoon Kim, Hyo-Soon Kang, Hee-Seok Lee | 2016-10-18 |