Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508577 | Semiconductor manufacturing apparatuses comprising bonding heads | Byung Joon LEE, Masato KAJINAMI, Yoshiaki Yukimori, Sang-Yoon Kim, Hui-Jae Kim +3 more | 2016-11-29 |
| 9431365 | Apparatus for bonding semiconductor chips | Seung Dae Seok, Sang-Yoon Kim, Hui-Jae Kim | 2016-08-30 |