Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397034 | Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same | — | 2016-07-19 |
HE
Hyung-Iae Eun — 1 Patent in 2016
Overall (2016): #375,182 of 481,213Top 80%
1
Patents 2016