HC

Hyun-Suk CHUN

Samsung: 1 patents #6,237 of 13,934Top 45%
📍 Yongin-si, KR: #1,203 of 2,524 inventorsTop 50%
Overall (2016): #375,197 of 481,213Top 80%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9368465 Method of forming bump pad structure having buffer pattern Soo-Jae Park 2016-06-14