Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9368481 | Semiconductor devices and packages having through electrodes | — | 2016-06-14 |
| 9312232 | Conductive bump, semiconductor chip and stacked semiconductor package using the same | — | 2016-04-12 |
| 9252139 | Stacked semiconductor package and method for manufacturing the same | — | 2016-02-02 |