Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9455217 | Semiconductor package including multiple chips and separate groups of leads | Chul-Sung Park, Kun-dae Yeom, Gwang-Man Lim | 2016-09-27 |
HK
Hyeong-Seob Kim
Overall (2016): #374,907 of 481,213Top 80%
1
Patents 2016