Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9455240 | Method of manufacturing semiconductor device and semiconductor device | Jumpei Konno, Takafumi Nishita, Kazunori Hasegawa, Michiaki Sugiyama | 2016-09-27 |
| 9355869 | Method of manufacturing semiconductor device | Michiaki Sugiyama | 2016-05-31 |
| 9349678 | Chip having a pillar electrode offset from the bonding pad | Yoshihiro Ono, Tsuyoshi Kida, Jumpei Konno, Kenji Sakata, Kentaro Mori +1 more | 2016-05-24 |