Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9263416 | Methods and materials useful for chip stacking, chip and wafer bonding | Christopher Apanius, Hendra Ng, Andrew Bell, Wei Zhang, Phillip S. Neal | 2016-02-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9263416 | Methods and materials useful for chip stacking, chip and wafer bonding | Christopher Apanius, Hendra Ng, Andrew Bell, Wei Zhang, Phillip S. Neal | 2016-02-16 |