Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496177 | Method and apparatus for plasma dicing a semi-conductor wafer | David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna | 2016-11-15 |
| 9368404 | Method for dicing a substrate with back metal | Peter Falvo, David Pays-Volard, Rich Gauldin, Russell Westerman | 2016-06-14 |
| 9343365 | Method and apparatus for plasma dicing a semi-conductor wafer | Thierry Lazerand, David Pays-Volard, Chris Johnson, Russell Westerman, Gordon M. Grivna | 2016-05-17 |