Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9331047 | Mounting method and mounting structure for semiconductor package component | Naomichi Ohashi, Atsushi Yamaguchi, Masato Udaka, Seiji Tokii | 2016-05-03 |
| 9322541 | Cooling structure | HIROHISA HINO, HONAMI NAWA | 2016-04-26 |
| 9237686 | Method and system for producing component mounting board | Koji Motomura, Hiroki Maruo, Yasuhiro Suzuki, Hironori Munakata | 2016-01-12 |