| 9519105 |
Self-assembled vertically aligned multi-chip module |
Xuezhe Zheng, Jin Hyoung Lee, Kannan Raj, Ashok V. Krishnamoorthy |
2016-12-13 |
| 9488777 |
Back-side etching and cleaving of substrates |
Jin Hyoung Lee, Xuezhe Zheng, Ashok V. Krishnamoorthy |
2016-11-08 |
| 9470855 |
Self-assembled vertically aligned multi-chip module |
Xuezhe Zheng, Jin Hyoung Lee, Kannan Raj, Ashok V. Krishnamoorthy |
2016-10-18 |
| 9465169 |
Single shot correction of resonant optical components |
Stevan S. Djordjevic, Shiyun Lin, Xuezhe Zheng, John E. Cunningham, Ashok V. Krishnamoorthy |
2016-10-11 |
| 9411177 |
Integrated electro-absorption modulator |
John E. Cunningham, Jin Yao, Guoliang Li, Xuezhe Zheng, Shiyun Lin +3 more |
2016-08-09 |
| 9297971 |
Hybrid-integrated photonic chip package with an interposer |
Hiren D. Thacker, Ashok V. Krishnamoorthy, Robert D. Hopkins, Jon Lexau, Xuezhe Zheng +2 more |
2016-03-29 |
| 9281268 |
Method for fabricating multi-chip module with multi-level interposer |
Eugene M. Chow, John E. Cunningham, James G. Mitchell |
2016-03-08 |
| 9250403 |
Hybrid-integrated photonic chip package with an interposer |
Hiren D. Thacker, Frankie Y. Liu, Robert D. Hopkins, Jon Lexau, Xuezhe Zheng +4 more |
2016-02-02 |
