Issued Patents 2016
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9523765 | Pixel-level oversampling for a time of flight 3D image sensor with dual range measurements | Tianjia Sun, Rui Wang | 2016-12-20 |
| 9478579 | Stacked chip image sensor with light-sensitive circuit elements on the bottom chip | Guannho George Tsau | 2016-10-25 |
| 9462179 | Image sensor with fast intra-frame focus | Eiichi Funatsu, Donghui Wu, Zheng Yang, Xiao Xie | 2016-10-04 |
| 9344658 | Negative biased substrate for pixels in stacked image sensors | Rui Wang, Dyson H. Tai, Sohei Manabe | 2016-05-17 |
| 9332193 | Synchronization of image acquisition in multiple image sensors with a synchronization clock signal | Junzhao Lei | 2016-05-03 |
| 9319613 | Image sensor having NMOS source follower with P-type doping in polysilicon gate | — | 2016-04-19 |
| 9319603 | Shared terminal of an image sensor system for transferring image data and control signals | Junzhao Lei | 2016-04-19 |
| 9313476 | Precharged latched pixel cell for a time of flight 3D image sensor | Tianjia Sun, Rui Wang | 2016-04-12 |
| 9305968 | Die seal ring for integrated circuit system with stacked device wafers | Yin Qian, Hsin-Chih Tai, Duli Mao, Cunyu Yang, Howard E. Rhodes | 2016-04-05 |
| 9299732 | Stacked chip SPAD image sensor | Eric A. G. Webster | 2016-03-29 |
| 9247162 | System and method for digital correlated double sampling in an image sensor | Jie Shen | 2016-01-26 |