Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9427830 | Copper alloy bonding wire for semiconductor | Tomohiro Uno, Takashi Yamada, Daizo Oda | 2016-08-30 |
| 9320152 | Solder ball and electronic member | Takayuki Kobayashi, Masamoto Tanaka, Katsuichi Kimura, Tadayuki Sagawa | 2016-04-19 |
| 9296180 | Metal foil for base material | Takayuki Kobayashi, Masamoto Tanaka, Masami Fujishima, Masao Kurosaki, Jun Maki +2 more | 2016-03-29 |