Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9304167 | Apparatus of three-dimensional integrated-circuit chip using fault-tolerant test through-silicon-via | Ting-Ting Hwang | 2016-04-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9304167 | Apparatus of three-dimensional integrated-circuit chip using fault-tolerant test through-silicon-via | Ting-Ting Hwang | 2016-04-05 |