Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490147 | Stud bump structure and method for manufacturing the same | Hsing-Hua Tsai, Jun-Der LEE | 2016-11-08 |
| 9425168 | Stud bump and package structure thereof and method of manufacturing the same | Hsing-Hua Tsai, Jun-Der LEE | 2016-08-23 |