Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9288907 | Microelectronic 3D packaging structure and method of manufacturing the same | Shao-Chung Hu, Ling-Yueh Yang, Wei-Ching Liu, Pen-Shan Chao, Kun-Feng Chen +1 more | 2016-03-15 |