Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406860 | Wafer level package structure for temperature sensing elements | Chung-I Chiang | 2016-08-02 |
| 9299862 | Device packaging method and device package structure | Chung-I Chiang | 2016-03-29 |