Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418949 | Semiconductor device having voids between top metal layers of metal interconnects | Chung-Hsin Lin, Ping-Heng Wu, Chao-Wen Lay, Hung-Mo Wu | 2016-08-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418949 | Semiconductor device having voids between top metal layers of metal interconnects | Chung-Hsin Lin, Ping-Heng Wu, Chao-Wen Lay, Hung-Mo Wu | 2016-08-16 |