Issued Patents 2016
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9526176 | Component-embedded resin substrate | Norio Sakai | 2016-12-20 |
| 9523709 | Method of manufacturing multilayer wiring board, probe card including multilayer wiring board manufactured by the method, and multilayer wiring board | — | 2016-12-20 |
| 9502891 | ESD protection device | — | 2016-11-22 |
| 9468100 | Multilayer wiring substrate | — | 2016-10-11 |
| 9456494 | Multilayer wiring substrate, probe card, and method for manufacturing multilayer wiring substrate | Norio Sakai | 2016-09-27 |
| 9451700 | Method for producing multi-layer substrate and multi-layer substrate | — | 2016-09-20 |
| 9402307 | Rigid-flexible substrate and method for manufacturing the same | Takayoshi Yoshikawa, Akinori TAKEZAWA | 2016-07-26 |
| 9398673 | ESD protection device and method for producing the same | — | 2016-07-19 |
| 9380699 | Ceramic multilayer substrate and method for manufacturing the same | — | 2016-06-28 |
| 9253881 | Multilayer flexible substrate | Norio Sakai | 2016-02-02 |
| 9241402 | Flexible multilayer substrate | Takashi Osawa | 2016-01-19 |
| 9241409 | Component-embedded resin substrate | — | 2016-01-19 |