Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9337797 | High frequency module | — | 2016-05-10 |
| 9245830 | Lead built-in type circuit package and method for producing same | Yoshio Fujii, Eisuke Mori, Shinji Hara | 2016-01-26 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9337797 | High frequency module | — | 2016-05-10 |
| 9245830 | Lead built-in type circuit package and method for producing same | Yoshio Fujii, Eisuke Mori, Shinji Hara | 2016-01-26 |