Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9351397 | Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using same | Keiichi Hasebe, Seiji Shika, Yoshinori Mabuchi | 2016-05-24 |