Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343576 | Thin film forming method, semiconductor substrate and electronic device produced by employing same | Seiichiro Higashi, Kohei Sakaike, Yoshitaka Kobayashi, Muneki Akazawa | 2016-05-17 |
| 9315289 | Packaging member and packaging method | Tomokazu SAITO, Atsushi Inoue, Seiji Terazawa, Mizuho Imaruoka, Chiharu Matsui | 2016-04-19 |