Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9347988 | Semiconductor testing jig and semiconductor testing method performed by using the same | Hajime Akiyama, Akira Okada | 2016-05-24 |
| 9335371 | Semiconductor evaluating device and semiconductor evaluating method | Hajime Akiyama, Akira Okada | 2016-05-10 |
| 9312160 | Wafer suction method, wafer suction stage, and wafer suction system | Hajime Akiyama, Akira Okada | 2016-04-12 |
| 9257316 | Semiconductor testing jig and transfer jig for the same | Akira Okada, Takaya Noguchi, Norihiro Takesako, Hajime Akiyama | 2016-02-09 |