Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9503622 | Preventing artifacts due to underfill in flip chip imager assembly | Xiaofeng Fan | 2016-11-22 |
| 9446941 | Method of lower profile MEMS package with stress isolations | Jie Zhao, Peter Hartwell | 2016-09-20 |
| 9240385 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Young Do Kweon | 2016-01-19 |