JM

Jack E. Murray

Micron: 1 patents #365 of 895Top 45%
📍 Boise, ID: #200 of 460 inventorsTop 45%
🗺 Idaho: #337 of 911 inventorsTop 40%
Overall (2016): #365,671 of 481,213Top 80%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9418926 Package-on-package semiconductor assemblies and methods of manufacturing the same Owen R. Fay 2016-08-16