Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230054 | High-frequency VLSI interconnect and intentional inductor impedance extraction in the presence of a multi-layer conductive substrate | — | 2016-01-05 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230054 | High-frequency VLSI interconnect and intentional inductor impedance extraction in the presence of a multi-layer conductive substrate | — | 2016-01-05 |