Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9369175 | Low fabrication cost, high performance, high reliability chip scale package | Jin-Yuan Lee, Ming-Ta Lei, Chuen-Jye Lin | 2016-06-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9369175 | Low fabrication cost, high performance, high reliability chip scale package | Jin-Yuan Lee, Ming-Ta Lei, Chuen-Jye Lin | 2016-06-14 |