Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9510479 | Fluid-cooled module for integrated circuit devices | — | 2016-11-29 |
| 9426931 | Fluid-flow-through cooling of circuit boards | Brian Kaplun, James S. Eiche | 2016-08-23 |
| 9389103 | Sensor array packaging solution | James E. Bishop, Allan Johnson, Brian Kaplun, Steven E. McElwain, Jr. | 2016-07-12 |