Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9416243 | Photocurable and thermosetting resin composition, dry film solder resist manufactured therefrom, and circuit board including the solder resist | Byung Ju Choi, Woo Jae Jeong, Bo Yun Choi, Min Su Jeong, Se Jin Ku | 2016-08-16 |
| 9410017 | Poly-amic acid, photo-sensitive resin composition, dry film, and circuit board | Jung Hak Kim, You-Jin Kyung, Hee Jung Kim | 2016-08-09 |
| 9389504 | Photo-curable and thermo-curable resin composition, and dry film solder resist | Se Jin Ku, Byung Ju Choi, Woo Jae Jeong, Bo Yun Choi, Min Su Jeong | 2016-07-12 |