Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9474145 | Substrate and method for manufacturing semiconductor package | Hyun-Bae Lee | 2016-10-18 |
| 9378987 | Semiconductor packages including gap in interconnection terminals and methods of manufacturing the same | Jungwoo Kim | 2016-06-28 |