FL

Fengyuan Lai

RI Rensselaer Polytechnic Institute: 1 patents #10 of 60Top 20%
IBM: 1 patents #5,048 of 10,295Top 50%
📍 Sherwood, OR: #22 of 49 inventorsTop 45%
🗺 Oregon: #1,647 of 4,070 inventorsTop 45%
Overall (2016): #403,677 of 481,213Top 85%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9512291 High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites Theodorian Borca-Tasciuc, Sushumna Iruvanti, Kamyar Pashayi, Joel L. Plawsky, Hafez Raeisi-Fard 2016-12-06