Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502371 | Methods of forming wire interconnect structures | Jon W. Brunner | 2016-11-22 |
| 9478516 | Methods of operating bonding machines for bonding semiconductor elements, and bonding machines | Matthew B. Wasserman, Michael P. Schmidt-Lange | 2016-10-25 |
| 9426898 | Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly | Guy Frick, Horst Clauberg | 2016-08-23 |