Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230908 | Through-wafer via device and method of manufacturing the same | Ronald Dekker, Marcel Mulder, Ruediger Mauczok | 2016-01-05 |
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Marcelis Bout
Overall (2016): #310,634 of 481,213Top 65%
1
Patents 2016