Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9399574 | MEMS package and a method for manufacturing the same | Peter V. Loeppert, Denise P. Czech, Lawrence A. Grunert, Qing Wang | 2016-07-26 |
| 9402118 | Housing and method to control solder creep on housing | Tony K. Lim | 2016-07-26 |
| 9301075 | MEMS microphone with out-gassing openings and method of manufacturing the same | John B. Szczech | 2016-03-29 |