Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9431364 | Multi-chip package assembly with improved bond wire separation | Kiah Ling Tan, Sally Foong, Chin Nguk Lai | 2016-08-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9431364 | Multi-chip package assembly with improved bond wire separation | Kiah Ling Tan, Sally Foong, Chin Nguk Lai | 2016-08-30 |