Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9373574 | Semiconductor packages and methods of forming the same | Ae-Nee Jang, Jaegwon Jang | 2016-06-21 |
| 9312213 | Bump structures having an extension | Moon Gi Cho, Sun-Hee Park, Hwan-Sik Lim | 2016-04-12 |
| 9299631 | Stack-type semiconductor package | Ae-Nee Jang | 2016-03-29 |
| 9281235 | Semiconductor packages and methods of forming the same | Taehoon Kim, Jongho Lee, Chul-Yong Jang | 2016-03-08 |
| 9245816 | Semiconductor package and method of manufacturing the semiconductor package | Chul-Yong Jang, Ae-Nee Jang | 2016-01-26 |