Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9465900 | System and method for designing semiconductor package using computing system, apparatus for fabricating semiconductor package including the system, and semiconductor package designed by the method | Jae-hoon Jeong, Won Cheol LEE, Bo-Sun Hwang, Chan Hwang | 2016-10-11 |