Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524927 | Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types | Tyson Leistiko, Huahung Kao | 2016-12-20 |
| 9417641 | Memory effect reduction using low impedance biasing | David M. Signoff, Ming He | 2016-08-16 |