Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496171 | Printed interconnects for semiconductor packages | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Matthew David Romig, Wei-Yan Shih | 2016-11-15 |
| 9378882 | Method of fabricating an electronic circuit | Richard J. Saye | 2016-06-28 |
| 9241405 | Interposer with extruded feed-through vias | — | 2016-01-19 |